BGA REWORK SYSTEM ZM-R730A – FOR LARGE SIZE PCB
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ZM-R730A Rework System – for Large Size PCB
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable(Height Moving Range 3CM)
- Ceramic honeycomb Infrared Preheater(Left/ Right Moving Range 30 CM)
- High-Precision PID Temperature Control System(5 K-type sensor, 10 temperature zone control )
- High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Testing Device To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
- Add a side camera, more clearly observe the rework process(Optional)
Application
Suitable for Normal SMD(BGA, QFP etc.) & Micro-SMD Components Repair, Max. 80mm x 80mm, Min. 0.5mm * 0.5mm IC. PCB motherboard support Max. 620mm x 520mm
Delivery time 2 weeks
Hotline: +84 988 919 818
+84 769 116 968
Email: cuong@smt-vn.com
sales@smt-vn.com
Technical Parameters
| ITEM | ZM-R730A |
|---|---|
| Operation Mode | High Automatic / Optical /Touch Panel |
| Voltage/Power | AC 380V±10% 50/60HZ / Top:1200W, Bottom:1200W, IR: 4800W |
| Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Temperature Precision | 2-3 ℃(5 Sensor Port) |
| Preheat Zone | 420×435mm |
| Optical Alignment Precision | 0.01MM |
| CCD Magnification: | 5X~50X |
| For PCB Size/Chip Size | PCB Size: 6*6MM~645*520MM / Chip Size: 3*3~80*80MM |
| Machine Dimension | L1000*W840*H950(MM) |
| Net Weight | 128KG |
| Standard Wooden Packing | Packing Size: L1100*W950*H1050(MM) / G.W: 180KG |
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