Machine characteristiccs
1, HD color global exposure digital camera speed increase 30%
2, High depth of field telecentric lens, which can measure the solder joints on the side of high components
3, Support the detection of smt front, back and dip station
4, Support 0201 packaged component inspection
5, CAD data import, automatic linking component library, automatic color picking
6, True non-stop offline programming and program update
7, MES data docking to realize intelligent factory
8, Support multi-line centralized management and remote service
Technical parameters
Model | ALE | ALE-D |
PCB Specifications | ||
Max. PCB size (X x Y) | 510mm x 460mm | Double lane :510mm x 330mmSingle lane:510mm x 600mm |
Min. PCB size (Y x X) | 50mm x 50mm | 50mm x 50mm |
PCB Thickness | 0.6mm-6mm | |
Board Edge Gap | Top: 3mm Bottom: 3mm (Width of transport belt contact with OCB/fixture) | |
Max. Bottom Gap | 50mm | |
Max. Top Gap | 35mm | |
Delivery Speed | 1500mm/s (MAX) | |
Transmission height from the ground | 900±30mm | |
Transmission lane direction | Left-Right,Right-Left,Left-Left,Right-Right | |
Transmission method | One Stage lane | |
PCB clamping method | Edge locking substrate clamping | |
Image parameters | ||
Camera | GigE Vision (Gigabit network interface), Resolution: 2448 x 2048(500 Mega Pixels) | |
FOV | 36mm x 30mm | |
Resolution | 15 μm | |
Lighting System | Multi-angle surrounding LED light source | |
Performance Parameyers | ||
Inspecting Contents | Missing parts, misalignment, tilted feet, virtual soldering, offset, pole reversal, tombstone,bridging, less tin, floating pins, bent pins, etc | |
Equipment | ||
Power requirements | AC220V±10%,50/60HZ,1.8kVA | |
Compressed air requirements | 4~6Kg/cm2 | |
Operating system | Windows 10 | |
External dimension | 1090mm(L) x 1290mm(W) x 1534mm(H) (Withoutlight,monitor and keyboard) | L(1090mm) x W(1500mm) x H(1534mm),(without tri-color lights, monitor and keyboard) |
Machine weight | About750KG | About850KG |
Environment temperature | 4~40˚C | |
Absolute humidity | 25-80%RH4 | |
Communication Method | Standard SMEMA Connection |
- Global exposure camera + telecentric lens
The global exposure camera has a faster exposure time than the roller shutter camera, which not only eliminates the dragging phenomenon of the roller shutter camera, but also increases the speed by more than 30%!
The telecentric lens solves the problem of wide- angle lens image distortion, and can easily deal with the detection of the side pads of high components And in linear test. deflection angle test, distance test, it has more accurate effect.
- Board Bending Compensation
When the board passes through the oven, due to the difference in heat absorption by various types of components on the board, the board is unevenly heated, resulting in a certain degree of deformation of the board. The CAD coordinates and the position of the board after passing through the oven cannot be accurately matched. After the plate bending is compensated, the coordinates and the corresponding positions of the components are accurate.
- Reference point positioning + pad positioning + body positioning
The industry’s strongest positioning method, easy to deal with a variety of severely deformed boards, especially for flexible boards, server motherboards and other products.
- Compreshensive Pad Defect Detection
Divide the pad into multiple areas, each area has the characteristtics of good and bad products, set the corresponding detection standards to measure.
- Offine Programming Systems & Opperating System
True offline programming, no-stop debugging and updating procedures. Centralized management, one person and multiple machines, through remote network, can also realize remote service and machine adjustment.
- Compatible With Various Shapes of Pads
Wave soldering algorithm supports various shapes of pads, positioning is more accurate.
Dimensional Appearance
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