
Application
Suitable for SMD(BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.
Please note: Specification are subject to change without notice!
Technical Parameters
| POWER SUPPLY: | AC 380V±10% 50/60 HZ |
|---|---|
| Total Power: | Max 9200W |
| Power of Top Hot Air Heater: | 1000 W |
| Power of Bottom Hot Air Heater: | 1200 W |
| Power of IR pre-heater: | 6600 W |
| Temperature Error: | ±1℃ |
| Placement Accuracy: | ±0.01mm |
| Placement Pressure: | <0.2N |
| Hot Air Heating Temperature: | 400℃(Max) |
| PCB Size: | 640mm×520mm |
| BGA Chip Size | 2×2mm–80×80mm |
| Control system | Industrial PC+Servo Motion control |
| Dimension: | L1020×W840×H1620mm |
| Sensor: | 5 |
| Net Weight: | About 230kg |
| Color: | White/Red |






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