* Function and Feature
Realize a hybrid process of mount and dispensing
New head unit for higher speed placement
Long board handling capability
Max. feeder capacity 180 lanes
* Recommend for Such Production Site
For customers who want a cost-effective yet super-flexible machine
Even though an entry model, it has high flexibility, basic functions and also proves an ideal multi-purpose machine for high-speed lines.
1. Achieves superior conveyor performance with enhanced PCB handling Multi-Conveyor System.
- Handles PCBs from L50xW30xT0.4mm to L955(S10)/L1,455(S20)xW510xT5.0mm with 4kg weight as standard feature (can handle 20kg or more by special order).
- Input and output buffer conveyor system is standard equipment, and auto selection of optimal conveyor settings is made according to PCB size.
- Laser sensor on head unit eliminates need for mechanical PCB stoppers. Automatically provides optimal PCB position regardless of size or shape even for cut-out PCBs.
2. Standard specifications allow handling nearly all component recognition processes.
- Handles from 0402mm to 120x90mm components with a standard camera (OP 0201mm onwards). Can place any component without having to worry about its specifications.
- Rear multi-scan camera (OP) ensures highly efficient component placement
3.Feeder banks can be freely arranged to match needs
- Maximum feeder capacity of 90 types (S10)/180 types (S20) + simultaneously accommodates two (S10)/four (S20) JEDEC tray types. (when all 45-lane feeder banks+RTS-1 are selected. During 8mm tape feeder conversion)
- Full range of retrofit kits allows changing from fixed feeder banks to feeder carriages/tray feeders; or feeder carriages/tray feeders to fixed feeder banks.
- Allows freely selecting different front/rear and left/right bank configurations according to production needs and budget.
- The CTF-36C can dock with each of the M10/M20 and S10/S20 in the same way as the CFB-36E/CFB-45E.
4. High-speed multi-purpose head and hybrid head meet a wide range of production needs.
- Can handle component heights up to 30mm Remark : Conveyor surface reference including PCB thickness
- Real-time force control function as standard feature, also capable of reducing stress on components and handling component insertion.
- PCB warp detection function as standard, automatic control of component release height during placement
- Wide FOV fiducial camera comes as a standard feature, capable of work recognition via optimal color element according to the work piece (fiducial marks and mounted components).
- One dispenser head (OP) can be installed per placement nozzle as needed as a hybrid head for repetitive hybrid dispensing and mounting processes.
- For customers who want to look at SMT line dedicated to R & D production
* For customers who want to look at SMT line dedicated to R & D production
1. Reduces the setup/changeover time.
- Maximum feeder capacity of 90 types (S10)/180 types (S20) + simultaneously accommodates two (S10)/four (S20) JEDEC tray types. (when all 45-lane feeder banks+RTS-1 are selected. During 8mm tape feeder conversion)
- Easy exchange to/from tray changer (CTF-36C) to/from the feeder carriage (CFB-36E/CFB-45E)
- Auto Nozzle Changer (ANC) with 24 holes available comes as a standard feature, and also ANC with 40 holes available as option to support further a wide range of components.
- Effective for prototype PCBs and high-mix low-volume production. Relocatability function (OP of Intelligent Feeder) for feeders and trays eliminates need for component supply position management.
2. Superb all-in-one functions make it usable as a single stand-alone machine
- Maximum feeder capacity of 90 types (S10)/180 types (S20) + simultaneously accommodates two (S10)/four (S20) JEDEC tray types. (when all 45-lane feeder banks+RTS-1 are selected. During 8mm tape feeder conversion)
- A wide range of components from 0402mm (OP 0201mm onwards) to 120x90mmxT30mm* can be handled as standard. Remark : Conveyor surface reference including PCB thickness
- Real-time force control function as standard feature, also capable of reducing stress on components and handling component insertion.
- PCB warp detection function as standard, automatic control of component release height during placement
- Auto Nozzle Changer (ANC) with 24 holes available as standard equipment, and also ANC with 40 holes as a option. Ideal for handling a variety of component types while changing nozzles
3. Various functions make it simple to create data
- iQvision(OP): Recognizes super-wide odd-shaped components that are difficult to handle by standard recognition.
- Wide FOV color FID camera: Reliable recognition of mounted components
- Data creation support function for tray component pickup position with multiple-image capture around the center
- Dispensing program: This can be created by batch conversion from placement program – Can be managed as single program with same cycle as placement program
4. Supports cost-cutting for prototype products.
- Auto-generation of dispensing program from Gerber data for metal stencils. This eliminates the cost of making metal stencils with dispensing-printing functions and that therefore do not need metal stencils.
- Dispensed dot inspection function (special order) that guarantees the quality of the dispensing function
- Handles a wide range of stick components; Simple general-purpose stick component tracks are supplied as standard accessories for the stick feeder.
* For customers who want to manufacture LED lighting PCBs
Dozens of functions allow manufacturing high-quality LED lighting PCBs at a low investment
1. Handles long size and heavy-weight PCBs.
- Handles PCB lengths up to L1,330m(S10)/1,830mm(S20) as option; comes with warped PCB transfer guide function that prevents transfer errors at conveyor entrance.
- Capable of handling PCB weight 4kg (standard) and 20kg or more (special orders) even including a PCB carrier.
- Rigid PCB supporting by double-sided clamping of top side and bottom side PCB edge surface
- Laser sensor on head unit eliminates need for mechanical PCB stoppers. Cut-out PCBs can be freely positioned at a desired point with the PCB edge setting. No impact stopping needed even for heavy PCBs.
2. Handles a variety of LED components with freely configurable feeder bank.
- Interface kit is available (standard OP) that allows connecting to feeders (ball feeders, etc.) made by other manufacturers.
- A full range of retrofit kits allowing changing the feeder bank layout
3. Heads and nozzles ideal for LED chip placement are selectable.
- Select from high-speed multi-purpose heads for mounting LED chips, and hybrid heads ideal for mounting LED lens covers.
- Laser PCB warp detection comes as a standard feature, automatic controlling of component release height during placement even for warped PCBs
- A wide FOV fiducial camera as standard feature, capable of work recognition with optimal color element according to work piece(fiducial marks and placed components).
- A wide range of semi-standard LED nozzles are available for mounting LED chips having a variety of shapes.
4. Equipped with functions to support high-quality LED lighting PCB production
- LED rank management function allows setting placement by rank condition (special order).
- Adhesive dispensing program for hybrid dispenser functions can be automatically generated by batch conversion from component placement programs.
* Hybrid production processes
True super-flexibility with everything the user “wants” clustered into a single unit that allows running the following processes
1. Hybrid dispenser function that carries out mounting and dispensing in a single cycle
- A maximum of 4 dispense heads can be installed.
- Mixed head configuration for mounting and dispensing allows running the dispensing->mounting-> dispensing-> mounting processes on a single unit.
- Utilizes a non-contact dispensing system and line dispensing function as a standard feature.
- Screw pump type dispenser: For high-speed micro-dot dispensing providing fine dispensing-volume control
- Air pulse type dispenser: For general-purpose dispensing that handles a wide range of dispensing materials and dot sizes
2. Mounting functions for hybrid processes
- Maximum 30mm height (component + PCB) can be achieved with the hybrid head which is also ideal for POP processes with height requirements.
- Hybrid heads with 30mm head pitch do not bind or interfere with each other even during line dispensing and large-size shield cover mounting in the same process.
3. Various types of special order functions to support hybrid processes
- Post dispensing inspection function guarantees an ample dispensing effect (special orders)
- Dispense nozzle tip cleaning function (special order) prevents the dispense material from dripping during the production process.
- 3D mounting function (special order) is capable of dispensing and mounting onto 3D objects.
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